View MT29F2G08AABWP_41723.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Features
NAND Flash Memory
MT29F2G08AABWP/MT29F2G16AABWP MT29F4G08BABWP/MT29F4G16BABWP MT29F8G08FABWP Features
* Organization: * Page size: x8: 2,112 bytes (2,048 + 64 bytes) x16: 1,056 words (1,024 + 32 words) * Block size: 64 pages (128K + 4K bytes) www..com * Device size: 2Gb: 2,048 blocks; 4Gb: 4,096 blocks; 8Gb: 8,192 blocks * Read performance: * Random read: 25s * Sequential read: 30ns (3V x8 only) * Write performance: * Page program: 300s (TYP) * Block erase: 2ms (TYP) * Endurance: 100,000 PROGRAM/ERASE cycles * Data retention: 10 years * First block (block address 00h) guaranteed to be valid without ECC (up to 1,000 PROGRAM/ERASE cycles) * VCC: 2.7V-3.6V * Automated PROGRAM and ERASE * Basic NAND command set: * PAGE READ, RANDOM DATA READ, READ ID, READ STATUS, PROGRAM PAGE, RANDOM DATA INPUT, PROGRAM PAGE CACHE MODE, INTERNAL DATA MOVE, INTERNAL DATA MOVE with RANDOM DATA INPUT, BLOCK ERASE, RESET * New commands: * PAGE READ CACHE MODE * READ UNIQUE ID (contact factory) * READ ID2 (contact factory) * Operation status byte provides a software method of detecting: * PROGRAM/ERASE operation completion * PROGRAM/ERASE pass/fail condition * Write-protect status * Ready/busy# (R/B#) pin provides a hardware method of detecting PROGRAM or ERASE cycle completion * PRE pin: prefetch on power up * WP# pin: hardware write protect
Figure 1:
48-PIN TSOP Type 1
Options
Marking
* Density: MT29F2GxxAAB 2Gb (single die) MT29F4GxxBAB 4Gb (dual-die stack) MT29F8GxxFAB 8Gb (quad-die stack) * Device width: MT29Fxx08x x8 MT29Fxx16x x16 * Configuration: # of die # of CE# # of R/B# 1 1 1 A 2 1 1 B 4 2 2 F A * VCC: 2.7V-3.6V * Second generation die B * Package: 48 TSOP type I (lead-free plating) WP 48 TSOP type I (contact factory) WG * Operating temperature: Commercial (0-70C) -- Extended temperature ET (-40C to +85C)
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__1.fm - Rev. H 9/05 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Part Numbering Information
Part Numbering Information
Micron NAND Flash devices are available in several different configurations and densities. (See Figure 2.) Figure 2: Part Number Chart
MT 29F 2G 08 Micron Technology Product Family
29F = Single-Supply NAND Flash Memory
A
A
B
WP
ES Production Status
Blank = Production ES = Engineering Sample MS = Mechanical Sample
Density
2G = 2Gb 4G = 4Gb 8G = 8Gb
Operating Temperature Range
Blank = Commercial (0C to +70C) ET = Extended (-40 to +85C)
www..com
Reserved for Future Use Device Width
08 = 8 bits 16 = 16 bits
Reserved for Future Use Package Codes
Classification
# of die # of CE# # of R/B# I/O
WP = 48-pin TSOP I (Lead-free) WG = 48-pin TSOP I (contact factory) 1 1 2 1 1 2 Common Common Common
A B F
1 2 4
Generation
A = 1st Generation Die B = 2nd Generation Die C = 3rd Generation Die
Operating Voltage Range
A = 3.3V (2.70V-3.60V)
Valid Part Number Combinations
After building the part number from the part numbering chart above, verify that the part number is valid using the Micron Part Marking Decoder Web site at http://www.micron.com/partsearch to verify that the part number is offered and valid. If the device required is not on this list, contact the factory.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__1.fm - Rev. H 9/05 EN
2
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Table of Contents Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Address Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 READs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 Ready/Busy# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Minimum Rp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Power-On AUTO-READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 www..com Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 READ Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 PAGE READ 00h-30h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 RANDOM DATA READ 05h-E0h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 PAGE READ CACHE MODE Start 31h; PAGE READ CACHE MODE Start Last 3Fh . . . . . . . . . . . . . . . . . . . . . .25 READ ID 90h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 READ STATUS 70h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 PROGRAM Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 PROGRAM PAGE 80h-10h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 SERIAL DATA INPUT 80h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 RANDOM DATA INPUT 85h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 PROGRAM PAGE CACHE MODE 80h-15h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Internal Data Move . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 READ FOR INTERNAL DATA MOVE 00h-35h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 INTERNAL DATA MOVE 85h-10h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 BLOCK ERASE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 BLOCK ERASE 60h-D0h. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 RESET FFh. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 WRITE PROTECT Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Error Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 VCC Power Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Timing Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29bTOC.fm - Rev. H 9/05 EN
3
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory List of Figures List of Figures
Figure 1: 48-PIN TSOP Type 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Figure 2: Part Number Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Figure 3: NAND Flash Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Figure 4: Pin Assignment (Top View) 48-Pin TSOP Type 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Figure 5: Memory Map x8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Figure 6: Memory Map x16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Figure 7: Array Organization for MT29F2G08AxB (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Figure 8: Array Organization for MT29F2G16AxB (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Figure 9: Array Organization for MT29F4G08BxB and MT29F8G08FxB (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Figure 10: Array Organization for MT29F4G16BxB (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Figure 11: READY/BUSY# Open Drain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Figure 12: tR and tF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Figure 13: Iol vs. Rp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Figure 14: TC vs. Rp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Figure 15: First Page Power-On AUTO-READ (3V VCC only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 www..com Figure 16: AC Waveforms During Power Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Figure 17: PAGE READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 Figure 18: RANDOM DATA READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Figure 19: PAGE READ CACHE MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Figure 20: READ ID Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Figure 21: Status Register Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Figure 22: PROGRAM and READ STATUS Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Figure 23: RANDOM DATA INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 Figure 24: PROGRAM PAGE CACHE MODE Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Figure 25: INTERNAL DATA MOVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Figure 26: INTERNAL DATA MOVE with RANDOM DATA INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Figure 27: BLOCK ERASE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Figure 28: RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Figure 29: ERASE Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Figure 30: ERASE Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Figure 31: PROGRAM Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Figure 32: PROGRAM Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Figure 33: COMMAND LATCH Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 Figure 34: ADDRESS LATCH Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 Figure 35: INPUT DATA LATCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Figure 36: SERIAL ACCESS Cycle After READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Figure 37: STATUS READ Cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Figure 38: PAGE READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Figure 39: READ Operation with CE# "Don't Care" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Figure 40: RANDOM DATA READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Figure 41: PAGE READ CACHE MODE Timing Diagram, Part 1 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 Figure 42: PAGE READ CACHE MODE Timing Diagram, Part 2 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Figure 43: PAGE READ CACHE MODE Timing without R/B#, Part 1 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Figure 44: PAGE READ CACHE MODE Timing without R/B#, Part 2 of 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 Figure 45: READ ID Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Figure 46: Program Operation with CE# "Don't Care" . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Figure 47: PROGRAM PAGE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Figure 48: PROGRAM PAGE Operation with RANDOM DATA INPUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Figure 49: INTERNAL DATA MOVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Figure 50: PROGRAM PAGE CACHE MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Figure 51: PROGRAM PAGE CACHE MODE Ending on 15h . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29bLOF.fm - Rev. H 9/05 EN Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
4
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory List of Figures
Figure 52: Figure 53: Figure 54: BLOCK ERASE Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
www..com
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29bLOF.fm - Rev. H 9/05 EN
5
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory List of Tables List of Tables
Table 1: Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Table 2: Array Addressing: MT29F2G08AxB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Table 3: Array Addressing: MT29F2G16AxB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 4: Array Addressing: MT29F4G08BxB and MT29F8G08FxB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Table 5: Array Addressing: MT29F4G16BxB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Table 6: Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 7: Command Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 Table 8: Device ID and Configuration Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28 Table 9: Status Register Bit Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Table 10: Status Register Contents After RESET Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Table 11: Absolute Maximum Ratings by Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Table 12: Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Table 13: DC and Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Table 14: Valid Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Table 15: Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 www..com Table 16: Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42 Table 17: AC Characteristics--Command, Data, and Address Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Table 18: AC Characteristics--Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Table 19: PROGRAM/ERASE Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29bLOT.fm - Rev. H 9/05 EN
6
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory General Description
General Description
NAND technology provides a cost-effective solution for applications requiring highdensity solid-state storage. The MT29F2G08AxB and MT29F2G16AxB are 2Gb NAND Flash memory devices. The MT29F4G08BxB and MT29F4G16BxB are two-die stacks that operate as a single 4Gb device. The MT29F8G08FAB is a four-die stack that operates as two independent 4Gb devices (MT29F4G08BxB), providing a total storage capacity of 8Gb in a single, space-saving package. Micron NAND Flash devices include standard NAND features as well as new features designed to enhance system-level performance. Micron NAND Flash devices use a highly multiplexed 8- or 16-bit bus (I/O[7:0] or I/O[15:0]) to transfer data, addresses, and instructions. The five command pins (CLE, ALE, CE#, RE#, WE#) implement the NAND command bus interface protocol. Three additional pins control hardware write protection (WP#), monitor device status (R/B#), and initiate the auto-read feature (PRE--3V device only). Note that the PRE function is not supported on extended-temperature devices.
www..com
This hardware interface creates a low-pin-count device with a standard pinout that is the same from one density to another, allowing future upgrades to higher densities without board redesign. MT29F2G and MT29F4G devices contain 2,048 and 4,096 erasable blocks respectively. Each block is subdivided into 64 programmable pages. Each page consists of 2,112 bytes (x8) or 1,056 words (x16). The pages are further divided into a 2,048-byte data storage region with a separate 64-byte area on the x8 device; and on the x16 device, separate 1,024-word and 32-word areas. The 64-byte and 32-word areas are typically used for error management functions. The contents of each 2,112-byte page can be programmed in 300s, and an entire 132Kbyte/66K word block can be erased in 2ms. On-chip control logic automates PROGRAM and ERASE operations to maximize cycle endurance. ERASE/PROGRAM endurance is specified at 100,000 cycles when using appropriate error correcting code (ECC) and error management.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
7
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory General Description
Figure 3: NAND Flash Functional Block Diagram
VCC VSS
I/O [7:0] I/O [15:0]
I/O Control
Address Register Status Register
Command Register
CE# CLE
Column Decode Control Logic Row Decode Data Register Cache Register
ALE
www..com
WE# RE# WP#
R/B#
Note:
The PRE function is not supported on extended-temperature devices.
Figure 4:
Pin Assignment (Top View) 48-Pin TSOP Type 1
x16
NC NC NC NC NC NC R/B# RE# CE# NC NC Vcc Vss NC NC CLE ALE WE# WP# DNU DNU DNU NC NC
x8
NC NC NC NC NC 1 R/B2# R/B# RE# CE# CE2#1 NC Vcc Vss NC NC CLE ALE WE# WP# DNU DNU DNU NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
x8
NC NC NC NC I/O7 I/O6 I/O5 I/O4 NC NC PRE/VSS2 Vcc Vss NC NC NC I/O3 I/O2 I/O1 I/O0 NC NC NC NC
x16
Vss I/O15 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 NC PRE/VSS2 Vcc NC NC NC I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/O0 Vss
Notes: 1. CE2# and R/B2# on 8Gb device only. These pins are NC for other configurations. 2. The PRE function is not supported on extended-temperature devices.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
8
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory General Description
Table 1: Pin Descriptions
Type Input Pin Function Address latch enable: During the time ALE is HIGH, address information is transferred from I/O[7:0] into the on-chip address register upon a LOW to HIGH transition on WE#. When address information is not being loaded, the ALE pin should be driven LOW. Chip enable: Gates transfers between the host system and the NAND device. Once the device starts a PROGRAM or ERASE operation, the chip enable pin can be deasserted. For the 8Gb configuration, CE# controls the first 4Gb of memory; CE2# controls the second 4Gb. See the Bus Operation section, starting on page 16, for additional operational details. Command latch enable: When CLE is HIGH, information is transferred from I/O[7:0] to the on-chip command register on the rising edge of WE#. When command information is not being loaded, the CLE pin should be driven LOW. Power-on read enable: Enables the auto-read function when at Vcc. See the bus operation section, starting on page 16, for additional details. Read enable: Gates transfers from the NAND device to the host system. Write enable: Gates transfers from the host system to the NAND device. Write protect: Pin protects against inadvertent PROGRAM and ERASE operations. All PROGRAM and ERASE operations are disabled when the WP# pin is LOW. Data inputs/outputs: The bidirectional I/O pins transfer address, data, and instruction information. Data is output only during READ operations; at other times the I/O pins are inputs.
Symbol ALE
CE#, CE2#
Input
CLE
Input
PRE1 (3V device only) www..com RE# WE# WP# I/O[7:0] MT29FxG08 I/O[15:0] MT29FxG16 R/B#, R/B2#
Input Input Input Input I/O
Output
VCC VSS DNU NC
Supply Supply -- --
Ready/busy: An open-drain, active-LOW output, that uses an external pull-up resistor. The pin is used to indicate when the chip is processing a PROGRAM or ERASE operation. The pin is also used during a READ operation to indicate when data is being transferred from the array into the serial data register. Once these operations have completed, the R/B# returns to the high-impedance state. In the 8Gb configuration, R/B# is for the 4Gb of memory enabled by CE#; R/B2# is for the 4Gb of memory enabled by CE2#. VCC: The VCC pin is the power supply pin. VSS: The VSS pin is the ground connection. Do not use: Must be left floating. No connect: NC pins are not internally connected. These pins can be driven or left unconnected.
Notes: 1. The PRE function is not supported on extended-temperature devices.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
9
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Architecture
Architecture
These devices use NAND electrical and command interfaces. Data, commands, and addresses are multiplexed onto the same pins. This provides a memory device with a low pin count. The internal memory array is accessed on a page basis. When doing reads, a page of data is copied from the memory array into the data register. Once copied to the data register, data is output sequentially, byte by byte on x8 devices, or word by word on x16 devices. The memory array is programmed on a page basis. After the starting address is loaded into the internal address register, data is sequentially written to the internal data register up to the end of a page. After all of the page data has been loaded into the data register, array programming is started. In order to increase programming bandwidth, this device incorporates a cache register. In the cache programming mode, data is first copied into the cache register and then into the data register. Once the data is copied into the data register, programming begins. After the data register has been loaded and programming started, the cache register becomes available for loading additional data. Loading the next page of data into the cache register takes place while page programming is in process. The INTERNAL DATA MOVE command also uses the internal cache register. Normally, moving data from one area of external memory to another uses a large number of external memory cycles. By using the internal cache register and data register, array data can be copied from one page and then programmed into another without using external memory cycles.
www..com
Addressing
NAND Flash devices do not contain dedicated address pins. Addresses are loaded using a five-cycle sequence as shown in Figures 7 and 8, on pages 12 and 13 respectively. Table 2 on page 12 presents address functions internal to the x8 device; Table 3 on page 13 covers the same functions for the x16 device. See Figures 5 and 6 on page 11 for additional memory mapping and addressing details.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
10
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Addressing
Figure 5: Memory Map x8
(4Gb: 3FFFF83Fh) 1FFFF83Fh (4Gb: 3FFC0000h) 1FFC0000h Spare Address within a page
A1 1 000BF83Fh 00080000h 0007F83Fh 00040000h 0003F83Fh 0
A5
A0
A28 (4Gb: A29)
A18
A1 7
page 63-0
A1 2
A1 1
A0
Block Address
Page Address within a block
Column Address within a page
Figure 6:
Memory Map x16
(4Gb: 1FFFFC1Fh) FFFF41Fh (4Gb: 1FFE0000h) FFE0000h Spare Address within a page
www..com
A1 0 005F41Fh 0040000h 003F41Fh 0020000h 001F41Fh 0
A4
A0
A27 (4Gb: A28)
A1 7
A1 6
page 63-0
A1 1
A1 0
A0
Block Address
Page Address within a block
Column Address
Note:
Block address and page address = actual page address.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
11
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Addressing
Figure 7: Array Organization for MT29F2G08AxB (x8)
2,112 bytes
I/O 0 Cache Register Data Register
2,048 2,048
64 64
I/O 7
www..com
2,048 blocks per device
1 Block
64 pages = 1 block (128K + 4K) bytes 1 page 1 block = (2K + 64 bytes) = (2K + 64) bytes x 64 pages = (128K + 4K) bytes
1 device = (2K + 64) bytes x 64 pages x 2,048 blocks = 2,112 Mb
Table 2:
Cycle First Second Third Fourth Fifth
Array Addressing: MT29F2G08AxB
I/O7 CA7 LOW RA19 RA27 LOW Note: I/O6 CA6 LOW RA18 RA26 LOW I/O5 CA5 LOW RA17 RA25 LOW I/O4 CA4 LOW RA16 RA24 LOW I/O3 CA3 CA11 RA15 RA23 LOW I/O2 CA2 CA10 RA14 RA22 LOW I/O1 CA1 CA9 RA13 RA21 LOW I/O0 CA0 CA8 RA12 RA20 RA28
CAx = column address; RAx = row address.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
12
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Addressing
Figure 8: Array Organization for MT29F2G16AxB (x16)
1,056 words
I/O 0 Cache Register Data Register
1,024 1,024
32 32
I/O 15
www..comblocks 2,048
1 Block
64 pages = 1 block (64K + 2K) words 1 page 1 block = (1K + 32) words = (1K + 32) words x 64 pages = (64K + 2K) words
per device
1 device = (1K + 32) words x 64 pages x 2,048 blocks = 2,112 Mb
Table 3:
Cycle First Second Third Fourth Fifth
Array Addressing: MT29F2G16AxB
I/O[15:8] LOW LOW LOW LOW LOW I/O7 CA7 LOW RA18 RA26 LOW I/O6 CA6 LOW RA17 RA25 LOW I/O5 CA5 LOW RA16 RA24 LOW I/O4 CA4 LOW RA15 RA23 LOW I/O3 CA3 LOW RA14 RA22 LOW I/O2 CA2 CA10 RA13 RA21 LOW I/O1 CA1 CA9 RA12 RA20 LOW I/O0 CA0 CA8 RA11 RA19 RA27
Notes: 1. CAx = column address; RAx = row address. 2. I/O[15:8] are not used during the addressing sequence and should be driven LOW.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
13
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Addressing
Figure 9: Array Organization for MT29F4G08BxB and MT29F8G08FxB (x8)
2,112 bytes
I/O 0 Cache Register Data Register
2,048 2,048
64 64
I/O 7
1 Block
4,096 blocks
www..com
64 pages = 1 block (128K + 4K) bytes 1 page 1 block = (2K + 64 bytes) = (2K + 64) bytes x 64 pages = (128K + 4K) bytes
1 device = (2K + 64) bytes x 64 pages x 4,096 blocks = 4,224 Mb
Note:
For the 8Gb MT29F8G08F, the 4Gb array organization shown here applies to each chip enable (CE# and CE2#).
Table 4:
Cycle First Second Third Fourth Fifth
Array Addressing: MT29F4G08BxB and MT29F8G08FxB
CAx = column address; RAx = row address. I/O7 CA7 LOW RA19 RA27 LOW I/O6 CA6 LOW RA18 RA26 LOW I/O5 CA5 LOW RA17 RA25 LOW I/O4 CA4 LOW RA16 RA24 LOW I/O3 CA3 CA11 RA15 RA23 LOW I/O2 CA2 CA10 RA14 RA22 LOW I/O1 CA1 CA9 RA13 RA21 RA291 I/O0 CA0 CA8 RA12 RA20 RA28
Notes: 1. Die address boundary: 0 = 0 - 2Gb, 1 = 2Gb - 4Gb.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
14
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Addressing
Figure 10: Array Organization for MT29F4G16BxB (x16)
1,056 words
I/O 0 Cache Register Data Register
1,024 1,024
32 32
I/O 15
www..com
4,096 blocks per device
1 Block
64 pages = 1 block (64K + 2K) words 1 page 1 block = (1K + 32) words = (1K + 32) words x 64 pages = (64K + 2K) words
1 device = (1K + 32) words x 64 pages x 4,096 blocks = 4,224 Mb
Table 5:
Cycle First Second Third Fourth Fifth
Array Addressing: MT29F4G16BxB
CAx = column address; RAx = row address. I/O[15:8] LOW LOW LOW LOW LOW I/O7 CA7 LOW RA18 RA26 LOW I/O6 CA6 LOW RA17 RA25 LOW I/O5 CA5 LOW RA16 RA24 LOW I/O4 CA4 LOW RA15 RA23 LOW I/O3 CA3 LOW RA14 RA22 LOW I/O2 CA2 CA10 RA13 RA21 LOW I/O1 CA1 CA9 RA12 RA20 RA281 I/O0 CA0 CA8 RA11 RA19 RA27
Notes: 1. Die address boundary: 0 = 0 - 2Gb, 1 = 2Gb - 4Gb. 2. I/O[15:8] are not used during the addressing sequence and should be driven LOW.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
15
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Bus Operation
Bus Operation
The bus on the MT29Fxxx devices is multiplexed. Data I/O, addresses, and commands all share the same pins. I/O pins I/O[15:8] are used only for data in the x16 configuration. Addresses and commands are always supplied on I/O[7:0]. The command sequence normally consists of a command latch cycle, an ADDRESS LATCH cycle, and a DATA cycle--either READ or WRITE.
Control Signals
CE#, WE#, RE#, CLE, ALE and WP# control Flash device READ and WRITE operations. On the 8Gb MT29F8G08FAB, CE# and CE2# each control independent 4Gb arrays. CE2# functions the same as CE# for its own array; all operations described for CE# also apply to CE2#. CE# is used to enable the device. When CE# is LOW and the device is not in the busy state, the Flash memory will accept command, data, and address information.
www..com
When the device is not performing an operation, the CE# pin is typically driven HIGH and the device enters standby mode. The memory will enter standby if CE# goes HIGH while data is being transferred and the device is not busy. This helps reduce power consumption. See Figure 39 on page 48 and Figure 46 on page 53 for examples of CE# "Don't Care" operations. The CE# "Don't Care" operation allows the NAND Flash to reside on the same asynchronous memory bus as other Flash or SRAM devices. Other devices on the memory bus can then be accessed while the NAND Flash is busy with internal operations. This capability is important for designs that require multiple NAND devices on the same bus. One device can be programmed while another is being read. A HIGH CLE signal indicates that a command cycle is taking place. A HIGH ALE signal signifies that an address input cycle is occurring.
Commands
Commands are written to the command register on the rising edge of WE# when: * CE# and ALE are LOW, and * CLE is HIGH, and * the device is not busy. The exceptions to this are the READ STATUS and RESET commands. Commands are transferred to the command register on the rising edge of WE#. See Figure 33 on page 45. Commands are input on I/O[7:0] only. For devices with a x16 interface, I/O[15:8] must be written with zeros when issuing a command.
Address Input
Addresses are written to the address register on the rising edge of WE# when: * CE# and CLE are low, and * ALE is high, and * the device is not busy. Addresses are input on I/O[7:0] only. For devices with a x16 interface, I/O[15:8] must be written with zeros when issuing an address. Generally all five ADDRESS cycles are written to the device. An exception to this is the BLOCK ERASE command, which requires only three ADDRESS cycles. See the "BLOCK ERASE Operation" section on page 35 for details.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
16
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Bus Operation
RANDOM DATA INPUT and OUTPUT commands need only column addresses, so only two ADDRESS cycles are required. Refer to the command descriptions to determine the addressing requirements for each command.
Data Input
Data is written to the data register on the rising edge of WE# when: * CE#, CLE, and ALE are LOW, and * the device is not busy. Data is input on I/O[7:0] for x8 devices, and I/O[15:0] on x16 devices. See Figure 35 on page 46 for additional data input details.
READs
After a READ command is sent to the memory device, data is transferred from the memory array to the data register in tR. Typically tR is 25s. When data is available in the data register, it is clocked out of the part by RE# going LOW. See Figure 38 on page 47 for detailed timing information. The READ STATUS (70h) command or the R/B# signal can be used to determine when the device is ready. See the STATUS READ command section on page 29 for details.
www..com
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
17
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Bus Operation Ready/Busy#
The R/B# output provides a hardware method of indicating the completion of a PROGRAM/ERASE/READ operation. The signal is typically HIGH, and transitions to LOW after the appropriate command is written to the device. The signal pin's open-drain driver enables multiple R/B# outputs to be OR-tied. The signal requires a pull-up resistor for proper operation. The READ STATUS command can be used in place of R/B#. Typically R/B# would be connected to an interrupt pin on the system controller. See Figure 11 on page 19. On the 8Gb MT29F8G08FAB, R/B# provides an indication for the 4Gb section enabled by CE#, and R/B2# does the same for the 4Gb section enabled by CE2#. R/B# and R/B2# can be tied together, or they can be used separately to provide independent indications for each 4Gb section. The combination of Rp and capacitive loading of the R/B# circuit determines the rise time of the R/B# pin. The actual value used for Rp depends on the system timing requirements. Large values of Rp cause R/B# to be delayed significantly. At the 10- to 90percent points on the R/B# waveform, rise time is approximately two time constants (TC).
TC = R * C where R = Rp and C = total capacitive load
www..com
The fall time of the R/B# signal is determined mainly by the output impedance of the R/B# pin and the total load capacitance. Refer to Figure 12 on page 19, and Figure 13 on page 20, which depict approximate Rp values using a circuit load of 100pF. The minimum value for Rp is determined by the output drive capability of the R/B# signal, the output voltage swing, and VCC.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
18
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Bus Operation Minimum Rp
VCC (MAX) - VOL (MAX) Rp (MIN, 3.3V part) = IOL + IL = 3.2V 8mA + IL
Where IL is the sum of the input currents of all devices tied to the R/B# pin.
Figure 11:
READY/BUSY# Open Drain
Rp VCC
www..com
R/B# Open drain output
IOL
GND Device
Figure 12:
t
R and tF
3.50 3.00 2.50 V 2.00 1.50 1.00 0.50 0.00 -1 0 2 4 TC 0 2 4 6
tF tR
Notes: 1. 2.
and tF calculated at 10%-90% points. dependent on external capacitance and resistive loading and output transistor impedance. 3. tR primarily dependent on external pull-up resistor and external capacitive loading. 4. tF 10ns at 3.3V. 5. See TC values in Figure 14 on page 20 for approximate Rp value and TC.
tR
tR
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
19
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Bus Operation
Figure 13: IOL vs. Rp
3.50mA 3.00mA 2.50mA I 2.00mA 1.50mA 1.00mA 0.50mA 0.00mA 0 2000 4000 6000 Rp 8000 10000 12000
IOL@3.60V (max)
www..com
Figure 14:
TC vs. Rp
1.20s 1.00s
T
800ns 600ns 400ns 200ns 0ns
0
2k
4k
6k Rp
8k
10k
12k
IOL@3.60V (max) RC = TC C = 100pF
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
20
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Bus Operation
Table 6:
CLE H L H L L L L X X X X
Mode Selection
ALE L H L H L L L X X X X CE# L L L L L L L X X X H H H X X X X H X X X X WE# RE# H H H H H WP#1 X X H H H X X H H L 0V/VCC PRE2 X X X X X X X X X X 0V/VCC Data input Sequential read and data output During read (busy) During program (busy) During erase (busy) Write protect Standby Write mode Mode Read mode Command input Address input Command input Address input
www..com
Notes: 1. WP# should be biased to CMOS HIGH or LOW for standby. 2. PRE should be tied to VCC or ground. Do not transition PRE during device operations. The PRE function is not supported on extended-temperature devices. 3. Mode selection settings for this table: H = Logic level HIGH; L = Logic level LOW; X = VIH or VIL.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
21
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Bus Operation Power-On AUTO-READ
During power-on, with the PRE pin at VCC, 3V VCC devices automatically transfer the first page of the memory array to the data register without requiring a command or address-input sequence. As VCC reaches approximately 2.5V, the internal voltage detector initiates the power-on AUTO-READ function. R/B# will stay LOW (tRPRE) while the first page of data is copied into the data register. See Table 18 on page 44 for the tRPRE value. Once the READ is complete and R/B# goes HIGH, RE# can be pulsed to output the first page of data. The PRE function is not supported on extended-temperature devices. Figure 15: First Page Power-On AUTO-READ (3V VCC only)
2.5V1 Vcc
CLE
www..com
CE#
WE#
ALE
PRE
tRPRE
R/B#
RE#
I/Ox
1st
2nd
3rd
.....
n th
Undefined
Notes: 1. Verified per device characterization; not 100% tested on all devices. 2. The PRE function is not supported on extended-temperature devices.
Figure 16:
AC Waveforms During Power Transitions
3V device: 2.5V Vcc HIGH WP# 3V device: 2.5V
WE#
10s
R/B#
Don't Care
Undefined
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
22
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
Command Definitions
Table 7:
Operation PAGE READ PAGE READ CACHE MODE START1 PAGE READ CACHE MODE START LAST1 READ for INTERNAL DATA MOVE2 RANDOM DATA READ3 READ ID READ STATUS PROGRAM PAGE PROGRAM PAGE CACHE1 PROGRAM for INTERNAL DATA MOVE2 www..com RANDOM DATA INPUT for PROGRAM 4 BLOCK ERASE RESET
Command Set
Cycle 1 00h 31h 3Fh 00h 05h 90h 70h 80h 80h 85h 85h 60h FFh Cycle 2 30h -- -- 35h E0h -- -- 10h 15h 10h -- D0h -- Valid During Busy No No No No No No Yes No No No No No Yes
Notes: 1. Do not cross die address boundaries when using cache operations. See Tables 4 and 5 for definition of die address boundaries. 2. Do not cross die address boundaries when using READ for INTERNAL DATA MOVE and PROGRAM FOR INTERNAL DATA MOVE. See Tables 4 and 5 for definition of die address boundaries. 3. RANDOM DATA READ command limited to use within a single page. 4. RANDOM DATA INPUT for PROGRAM command limited to use within a single page.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
23
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions READ Operations
PAGE READ 00h-30h On initial power up, each device defaults to read mode. To enter the read mode while in operation, write the 00h-30h command sequence to the command register along with the five ADDRESS cycles. Writing 00h to the command register starts the ADDRESS LATCH cycle. Five ADDRESS cycles are input next. Finally the 30h command is loaded into the command register. While monitoring the read status to determine when the tR (transfer from Flash array to data register) is complete, the user must re-issue the READ (00h) command to make the change from STATUS to DATA. (See Figure 43 on page 51 and Figure 44 on page 52 for examples.) After the READ command has been re-issued, pulsing the RE# line will result in outputting data, starting from the initial column address. A serial page read sequence outputs a complete page of data. After 30h is written, the page data is transferred to the data register, and R/B# goes LOW during the transfer. When the transfer to the data register is complete, R/B# returns HIGH. At this point, data can be read from the device. Starting from the initial column address to the end of the page, read the data by repeatedly pulsing RE# at the maximum tRC rate. (See Figure 17 on page 24.)
www..com
Figure 17:
CLE
PAGE READ Operation
CE#
WE#
ALE
tR
R/B#
RE#
I/Ox
00h
Address (5 Cycles)
30h
Data Output (Serial Access)
Don`t Care
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
24
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
RANDOM DATA READ 05h-E0h The RANDOM DATA READ command enables the user to specify a new column address so the data at single or multiple addresses can be read. The random read mode is enabled after a normal PAGE READ (00h-30h sequence). Random data can be output after the initial page read by writing an 05h-E0h command sequence along with the new column address (two cycles). The RANDOM DATA READ command can be issued without limit within the page. Only data on the current page can be read. Pulsing the RE# pin outputs data sequentially. See Figure 18 on page 25. Figure 18: RANDOM DATA READ Operation
tR
R/B#
www..com
RE#
I/Ox
00h
Address (5 Cycles)
30h
Data Output
05h
Address (2 Cycles)
E0h
Data Output
PAGE READ CACHE MODE Start 31h; PAGE READ CACHE MODE Start Last 3Fh Micron NAND Flash devices have a cache register that can be used to increase READ operation speed when accessing sequential pages in a block. First, a normal PAGE READ (00h-30h) command sequence is issued. (See Figure 19 on page 26 for operation details.) The R/B# signal goes LOW for tR during the time it takes to transfer the first page of data from the memory to the data register. After R/B# returns to HIGH, the PAGE READ CACHE MODE START (31h) command is latched into the command register. R/B# goes LOW for tDCBSYR1 while data is being transferred from the data register to the cache register. Once the data register contents are transferred to the cache register, another PAGE READ is automatically started as part of the 31h command. Data is transferred from the next sequential page of the memory array to the data register during the same time data is being read serially (pulsing of RE#) from the cache register. If the total time to output data exceeds tR, then the PAGE READ is hidden. The second and subsequent pages of data are transferred to the cache register by issuing additional 31h commands. R/B# will stay LOW up to tDCBSYR2. This time can vary, depending on whether the previous memory-to-data-register transfer was completed prior to issuing the next 31h command. If the data transfer from memory to the data register is not completed before the 31h command is issued, R/B# stays LOW until the transfer is complete. It is not necessary to output a whole page of data before issuing another 31h command. R/B# will stay LOW until the previous PAGE READ is complete and the data has been transferred to the cache register. To read out the last page of data, the PAGE READ CACHE MODE START LAST (3Fh) command is issued. This command transfers data from the data register to the cache register without issuing another PAGE READ. (See Figure 19 on page 26.)
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
25
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
tDCBSYR2
www..com
tDCBSYR2
tDCBSYR1
PAGE READ CACHE MODE
tR
Figure 19:
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
WE#
R/B#
26
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
I/Ox
CLE
CE#
ALE
RE#
00h
Address (5 Cycles)
30h
31h
Data Output (Serial Access)
31h
Data Output (Serial Access)
3fh
Data Output (Serial Access)
Don`t Care
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
READ ID 90h The READ ID command is used to read the 4 bytes of identifier codes programmed into the devices. The READ ID command reads a 4-byte table that includes Manufacturer's ID, device configuration, and part-specific information. See Table 8 on page 28, which shows complete listings of all configuration details. Writing 90h to the command register puts the device into the read ID mode. The command register stays in this mode until another valid command is issued. (See Figure 20.) Figure 20: READ ID Operation
CLE
CE#
www..com
WE# tAR ALE
RE# tWHR I/Ox 90h 00h Address, 1 Cycle tREA Byte 0 Manufacturer ID1 Byte 1 Device ID1 Byte 2 Don't Care Byte 31
Notes: 1. See Table 8 on page 28.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
27
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
Table 8: Device ID and Configuration Codes
Options Byte 0 Manufacturer ID Micron Device ID 2Gb, x8, 3V 2Gb, x16, 3V 4Gb, x8, 3V 4Gb, x16, 3V 8Gb, x8, 3V I/O7 0 1 1 1 1 1 x I/O6 0 1 1 1 1 1 x I/O5 1 0 0 0 0 0 x I/O4 0 1 0 1 0 1 x I/O3 1 1 1 1 1 1 x I/O2 1 0 0 1 1 1 x I/O1 0 1 1 0 0 0 x 0 0 0 0 1 0 0 0 0 1 0 0 1 1 0 0 1 1 0 0 1 1 1 1 I/O0 0 0 0 0 0 0 x 1 Value1 2Ch DAh CAh DCh CCh DCh XXh 01b 01b 01b 0b 1b 0b 15h 55h Notes
Byte 1 MT29F2G08AAB MT29F2G16AAB MT29F4G08BAB MT29F4G16BAB MT29F8G08FAB Byte 2 Byte value Don't Care Byte 3 Page size 2KB www..com Spare area size (bytes) 64 Block size (w/o spare) 128KB Organization x8 x16 Reserved Byte value x8 Byte value x16
2
Notes: 1. b = binary, h = hex 2. The MT29F8G08FAB device ID code reflects the configuration of each 4Gb section.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
28
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
READ STATUS 70h These NAND Flash devices have an 8-bit status register that the software can read during device operation. On the x16 device, I/O[15:8] are "0" when reading the status register. Table 9 describes the status register. After the READ STATUS command has been issued to the NAND Flash device, all subsequent READ cycles will output data from the status register until another command is issued. Note that the RE# pin can be toggled multiple times without issuing a new READ STATUS command, as shown in Figure 21. Each time the RE# pin is toggled, the updated status will be output on I/O[7:0]. In addition, after a READ STATUS command has been issued to the NAND Flash device, the status register provides continually updated output on I/O[7:0] as long as CE# and RE# are held LOW, i.e., RE# does not have to be toggled. Note that MT29FxGxxxAB devices do not support a READ STATUS operation in which the READ STATUS (70h) command is repeatedly issued after each RE# toggle.
www..com
Additional details regarding READ STATUS implementation are available in technical note TN-29-13 at: www.micron.com/products/nand/massstorage/technote.
Figure 21:
CE#
Status Register Operation
CLE
tCLEA tCLR
WE#
tREA
RE#
I/Ox
70h
Status
Status
Status
Toggle RE# as required
While monitoring the read status to determine when the tR (transfer from Flash array to data register) is complete, the user must re-issue the READ (00h) command to make the change from STATUS to DATA. After the READ command has been re-issued, pulsing the RE# line will output data, starting from the initial column address.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
29
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
Table 9:
SR Bit 0 1 2 3 4 5 6 7
Status Register Bit Definition
Page Program Pass/fail -- -- -- -- Ready/busy Ready/busy Program Page Cache Mode Pass/fail (N) Pass/fail (N-1) -- -- -- Ready/busy1 Ready/busy cache2 Write protect -- Page Read -- -- -- -- -- Ready/busy Ready/busy Write protect -- Page Read Cache Mode -- -- -- -- -- Ready/busy1 Ready/busy cache2 Write protect -- Block Erase Pass/fail Definition
www..com
Write protect --
[15:8]
"0" = Successful PROGRAM/ERASE "1" = Error in PROGRAM/ERASE -- "0" = Successful PROGRAM/ERASE "1" = Error in PROGRAM/ERASE -- "0" -- "0" -- "0" Ready/busy "0" = Busy "1" = Ready Ready/busy "0" = Busy "1" = Ready Write protect "0" = Protected "1" = Not protected -- "0"
Notes: 1. Status register bit 5 is "0" during the actual programming operation. If cache mode is used, this bit will be "1" when all internal operations are complete. 2. Status register bit 6 is "1" when the cache is ready to accept new data. R/B# follows bit 6. See Figure 19 on page 26, and Figure 24 on page 32.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
30
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions PROGRAM Operations
PROGRAM PAGE 80h-10h Micron NAND Flash devices are inherently page-programmed devices. Within a block, the pages must be programmed consecutively from the least significant bit (LSB) page of the block to most significant bit (MSB) pages of the block. Random page address programming is prohibited. Micron NAND flash devices also support partial-page programming operations. This means that any single bit can only be programmed one time before an erase is required; however, the page can be partitioned such that a maximum of eight programming operations are allowed before an erase is required. SERIAL DATA INPUT 80h PAGE PROGRAM operations require loading the SERIAL DATA INPUT (80h) command into the command register, followed by five ADDRESS cycles, then the data. Serial data is loaded on consecutive WE# cycles starting at the given address. The PROGRAM (10h) www..com command is written after the data input is complete. The internal write state machine automatically executes the proper algorithm and controls all the necessary timing to program and verify the operation. Write verification only detects "1s" that are not successfully written to "0s." R/B# goes LOW for the duration of array programming time, tPROG. The READ STATUS REGISTER (70h) command and the RESET (FFh) command are the only commands valid during the programming operation. Bit 6 of the status register will reflect the state of R/B#. When the device reaches ready, read bit 0 of the status register to determine if the program operation passed or failed. (See Figure 22.) The command register stays in read status register mode until another valid command is written to it. RANDOM DATA INPUT 85h After the initial data set is input, additional data can be written to a new column address with the RANDOM DATA INPUT (85h) command. The RANDOM DATA INPUT command can be used any number of times in the same page prior to issuing the PAGE WRITE (10h) command. See Figure 23 for the proper command sequence. Figure 22: PROGRAM and READ STATUS Operation
tPROG R/B# 70h
I/Ox
80h
Address (5 Cycles)
DIN
10h
Status
I/O 0 = 0 PROGRAM successful I/O 0 = 1 PROGRAM error
Figure 23:
RANDOM DATA INPUT
tPROG R/B# I/Ox
80h
Address (5 Cycles)
DIN
85h
Address (2 Cycles)
DIN
10h
70h
Status
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
31
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
PROGRAM PAGE CACHE MODE 80h-15h Cache programming is actually a buffered programming mode of the standard PAGE PROGRAM command. Programming is started by loading the SERIAL DATA INPUT (80h) command to the command register, followed by five cycles of address, and a full or partial page of data. The data is initially copied into the cache register, and the CACHE WRITE (15h) command is then latched to the command register. Data is transferred from the cache register to the data register on the rising edge of WE#. R/B# goes LOW during this transfer time. After the data has been copied into the data register and R/B# returns to HIGH, memory array programming begins. When R/B# returns to HIGH, new data can be written to the cache register by issuing another CACHE PROGRAM command sequence. The time that R/B# stays LOW will be controlled by the actual programming time. The first time through equals the time it takes to transfer the cache register contents to the data register. On the second and subsequent programming passes, transfer from the cache register to the data register is held off until current data register content has been programmed into the array.
www..com
Bit 6 (Cache R/B#) of the status register can be read by issuing the READ STATUS (70h) command to determine when the cache register is ready to accept new data. The R/B# pin always follows bit 6. Bit 5 (R/B#) of the status register can be polled to determine when the actual programming of the array is complete for the current programming cycle. If just the R/B# pin is used to determine programming completion, the last page of the program sequence must use the PROGRAM PAGE (10h) command instead of the CACHE PROGRAM (15h) command. If the CACHE PROGRAM (15h) command is used every time, including the last page of the programming sequence, status register bit 5 must be used to determine when programming is complete. (See Figure 24.) Bit 0 of the status register returns the pass/fail for the previous page when bit 6 of the status register is a "1" (ready state). The pass/fail status of the current PROGRAM operation is returned with bit 0 of the status register when bit 5 of the status register is a "1" (ready state). (See Figure 24.)
Figure 24:
PROGRAM PAGE CACHE MODE Example
tCBSY tCBSY tCBSY tLPROG1
R/B#
I/Ox
80h
Address & Data Input
15h
80h
Address & Data Input
15h
80h
Address & Data Input
15h
80h
Address & Data Input
10h
A: Without status reads.
tCBSY
tPROG
R/B# I/Ox
80h Address & Data Input 15h 70h Status2 Output 80h Address & Data Input 10h 70h Status2 Output
B: With status reads.
Notes: 1. See Note 3, Table 19 on page 44. 2. Check I/O[6:5] for internal Ready/Busy. Check I/O[1:0] for pass fail. RE# can stay LOW or pulse multiple times after a 70h command.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
32
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions Internal Data Move
An internal data move requires two command sequences. Issue a READ for INTERNAL DATA MOVE (00h-35h) command first, then the INTERNAL DATA MOVE (85h-10h) command. Data moves are only supported within the die from which data is read. READ FOR INTERNAL DATA MOVE 00h-35h This READ command is used in conjunction with the INTERNAL DATA MOVE (85h- 10h) command. First, (00h) is written to the command register, then the internal source address is written (five cycles). After the address is input, the READ for INTERNAL DATA MOVE (35h) command writes to the command register. This transfers a page from memory into the cache register. The written column addresses are ignored even though all five ADDRESS cycles are required. The memory device is now ready to accept the INTERNAL DATA MOVE (85h-10h) command. Please refer to the description of this command in the following section.
www..com
INTERNAL DATA MOVE 85h-10h After the READ for INTERNAL DATA MOVE command has been issued and R/B# goes HIGH, the INTERNAL DATA MOVE command can be written to the command register. This command transfers the data from the cache register to the data register and programming of the new destination page begins. After the INTERNAL DATA MOVE command and address sequence are written to the device, R/B# goes LOW while the internal control logic automatically programs the new page. The READ STATUS command and bit 6 of the status register can be used instead of the R/B# line to determine when the write is complete. Bit 0 of the status register indicates if the operation was successful. The RANDOM DATA INPUT (85h) command can be used during the INTERNAL DATA MOVE command sequence to modify a word or multiple words of the original data. First, data is copied into the cache register using the 00h-35h command sequence, then the RANDOM DATA INPUT (85h) command is written along with the address of the data to be modified next. New data is input on the external data pins. This copies the new data into the cache register. When 10h is written to the command register, the original data plus the modified data is transferred to the data register, and programming of the new page is started. The RANDOM DATA INPUT command can be issued as many times as necessary before starting the programming sequence with 10h. (See Figures 25 and 26 on page 34.) Because the INTERNAL DATA MOVE operation does not utilize external memory, ECC cannot be used to check for errors before programming the data to a new page. This can lead to a data error if the source page contains a bit error due to charge loss or charge gain. In the case that multiple INTERNAL DATA MOVE operations are performed, these bit errors may accumulate without correction. For this reason, it is highly recommended that systems utilizing the INTERNAL DATA MOVE operation use a robust ECC scheme that can correct two or more bits per sector.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
33
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
Figure 25: INTERNAL DATA MOVE
tR tPROG
R/B#
I/Ox
00h
Address (5 Cycles)
35h
85h
Address (5 Cycles)
10h
70h
Status
Figure 26:
INTERNAL DATA MOVE with RANDOM DATA INPUT
tR tPROG
R/B#
Address (5 Cycles) Address (5 Cycles) Address (2 Cycles)
www..com
I/Ox
00h
35h
85h
Data
85h
Data
10h
70h
Status
Unlimited number of repetitions.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
34
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions BLOCK ERASE Operation
BLOCK ERASE 60h-D0h Erasing occurs at the block level. For example, the MT29F2G08xxB device has 2,048 erase blocks organized as 64 2,112-byte (2,048 + 64 bytes) pages per block. Each block is 132K bytes (128K + 4K bytes). The BLOCK ERASE command operates on one block at a time. (See Figure 27.) Three cycles of addresses A[28:18] are required for the x8 device, and three cycles of addresses [27:17] are required for the x16 device. Although addresses A[17:12] (x8) and A[16:11] (x16) are loaded, they are a "Don't Care" and are ignored for BLOCK ERASE operations. (See Figures 5 and 6 on page 11 for addressing details.) The actual command sequence is a two-step process. The ERASE SETUP (60h) command is first written to the command register. Then three cycles of addresses are written to the device. Next, the ERASE CONFIRM (D0h) command is written to the command register. At the rising edge of WE#, R/B# goes LOW and the internal write state machine automatically controls the timing and erase-verify operations. R/B# stays LOW for the entire tBERS erase time. The READ STATUS REGISTER command can be used to check the status of the ERASE operation. When bit 6 = "1" the erase operation is complete. Bit 0 indicates a pass/fail condition where "0" = pass. (See 35, and Table 9 on page 30.) Figure 27:
CLE
www..com
BLOCK ERASE Operation
CE#
WE#
ALE
tBERS
R/B#
RE#
I/Ox
60h
Address Input (3 Cycles)
D0h
70h
Status
I/O 0 = 0 ERASE successful I/O 0 = 1 ERASE error
Don`t Care
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
35
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions RESET Operation
RESET FFh The RESET command is used to put the memory device into a known condition and to abort a command sequence in progress. RANDOM READ, PROGRAM, and ERASE commands can be aborted while the device is in the busy state. The contents of the memory location being programmed or the block being erased are no longer valid. The data may be partially erased or programmed, and is invalid. The command register is cleared and is ready for the next command. The status register contains the value E0h when WP# is HIGH; otherwise it is written with a 60h value. R/B# goes low for tRST after the RESET command is written to the command register. (See Figure 28 and Table 10.) Figure 28: RESET Operation
CLE
www..com
CE#
tWB
WE#
tRST
R/B#
I/Ox
FF RESET Command
Table 10:
Condition WP# HIGH WP# LOW
Status Register Contents After RESET Operation
Status Ready Ready and write protected Bit 7 1 0 Bit 6 1 1 Bit 5 1 1 Bit 4 0 0 Bit 3 0 0 Bit 2 0 0 Bit 1 0 0 Bit 0 0 0 Hex E0h 60h
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
36
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions WRITE PROTECT Operation
The WRITE PROTECT feature protects the device against inadvertent PROGRAM and ERASE operations. All PROGRAM and ERASE operations are disabled when WP# is LOW. For WRITE PROTECT timing details, see Figures 29 through 32. Figure 29: ERASE Enable
WE# tWW I/Ox 60h D0h
WP#
www..com
R/B#
Figure 30:
ERASE Disable
WE# tWW I/Ox 60h D0h
WP#
R/B#
Figure 31:
PROGRAM Enable
WE# tWW I/Ox 80h 10h
WP#
R/B#
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
37
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Command Definitions
Figure 32: PROGRAM Disable
WE# tWW I/Ox 80h 10h
WP#
R/B#
www..com
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
38
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Error Management
Error Management
Micron NAND devices are specified to have a minimum of 2,008 (NVB) valid blocks out of every 2,048 total available blocks. This means the devices may have blocks that are invalid when they are shipped. An invalid block is one that contains one or more bad bits. Additional bad blocks may develop with use. However, the total number of available blocks will not fall below NVB during the endurance life of the product. Although NAND memory devices may contain bad blocks, they can be used quite reliably in systems that provide bad-block mapping, replacement, and error correction algorithms. This type of software environment ensures data integrity. Internal circuitry isolates each block from other blocks, so the presence of a bad block does not affect the operation of the rest of the Flash device. The first block in each Micron NAND device is guaranteed to be free of defects when shipped from the factory (up to 1,000 PROGRAM/ERASE cycles). This provides a reliable location for storing boot code and critical boot information.
www..com
Before NAND devices are shipped from Micron, they are erased. The factory identifies invalid blocks before shipping by programming data other than FFh (x8) or FFFFh (x16) into the first spare location (column address 2,048 for x8 devices, or 1,024 for x16 devices) of the first 2 pages of each bad block. System software should check the first spare address on the first 2 pages of each block prior to performing any erase or programming operations on the Flash device. A bad block table can then be created, allowing system software to map around these areas. Factory testing is performed under worst-case conditions. Because blocks marked "bad" may be marginal, it may not be possible to recover this information if the block is erased. Over time, some memory locations may fail to program or erase properly. In order to ensure that data is stored properly over the life of the Flash device, certain precautions must be taken, such as: * Always check status after a WRITE, ERASE, or DATA MOVE operation. * Use some type of error detection and correction algorithm to recover from single-bit errors. * Use a bad-block replacement algorithm.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
39
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Electrical Characteristics
Electrical Characteristics
Table 11:
Device MT29FxGxxxAx MT29FxGxxxAx Storage temperature Short circuit output current, I/Os VIN VCC TSTG
Absolute Maximum Ratings by Device
Symbol Supply voltage on any pin relative to Vss Min -0.6 Max +4.6 +150 5 Unit V C mA
-65
Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not guaranteed. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
www..com
Table 12:
Recommended Operating Conditions
Symbol Commercial Extended
tA tA
Parameter/Condition Operating temperature VCC supply voltage Supply voltage
Min 0 -40 2.7 0
Typ -- -- 3.3 0
Max +70 +85 3.6 0
Unit
oC oC
Vcc Vss
V V
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
40
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Electrical Characteristics VCC Power Cycling
Micron NAND Flash devices are designed to prevent data corruption during power transitions. VCC is internally monitored. When VCC goes below 1.1V, PROGRAM and ERASE functions are disabled. WP# provides additional hardware protection. WP# should be kept at VIL during power cycling. When VCC reaches 1.1V, a minimum of 10s should be allowed for the Flash to initialize before executing any commands. (See Figure 16 on page 22.) Table 13:
Parameter Sequential read current
t
DC and Operating Characteristics
Conditions CYCLE = 30ns, CE# = VIL, IOUT = 0mA -- -- CE# = VIH, PRE = WP# = 0V/VCC CE# = VCC - 0.2V, PRE = WP# = 0V/VCC CE# = VCC - 0.2V, PRE = WP# = 0V/VCC VIN = 0V to VCC VOUT = 0V to VCC I/O [7-0], I/O [15-0] CE#, CLE, ALE, WE#, RE#, WP#, PRE, R/B# -- IOH = -400A IOL = 2.1mA VOL = 0.4V Symbol Icc1 Min -- Typ 15 Max 30 Unit mA
Program current Erase current www..com Standby current (TTL) Standby current (CMOS) MT29F2GxxAAB Standby current (CMOS) MT29F4GxxBAB MT29F8G08FAB Input leakage current Output leakage current Input high voltage
ICC2 ICC3 ISB1 ISB2 ISB2
-- -- -- -- --
15 15 -- 10 20
30 30 1 50 100
mA mA mA A A
ILI ILO VIH
-- -- 0.8 x Vcc
-- -- --
10 10 VCC + 0.3
A A V
Input low voltage (all inputs) Output high voltage Output low voltage Output low current (R/B#) Note:
VIL VOH VOL IOL (R/B#)
-0.3 2.4 -- 8
-- -- -- 10
0.8 -- 0.4 --
V V V mA
The PRE function is not supported on extended-temperature devices.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
41
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Electrical Characteristics
Table 14:
Parameter Number of valid blocks
Valid Blocks
Symbol NVB Device MT29F2GxxAAB MT29F4GxxBAB MT29F8G08FAB Min 2,008 4,016 8,032 Max 2,048 4,096 8,192 Unit Blocks Notes 1, 2
Notes: 1. Invalid blocks are blocks that contain one or more bad bits. The device may contain bad blocks upon shipment. Additional bad blocks may develop over time; however, the total number of available blocks will not drop below NVB during the endurance life of the device. Do not erase or program blocks marked invalid by the factory. 2. Block 00h (the first block) is guaranteed to be valid and does not require error correction up to 1,000 PROGRAM/ERASE cycles.
Table 15:
Description
Capacitance
Symbol CIN Device MT29F2GxxAAB MT29F4GxxBAB MT29F8G08FAB MT29F2GxxAAB MT29F4GxxBAB MT29F8G08FAB Max 10 20 40 10 20 40 Unit pF Notes 1, 2
www..com Input capacitance
Input/output capacitance (I/O)
CIO
pF
1, 2
Notes: 1. These parameters are verified in device characterization and are not 100% tested. 2. Test conditions: Tc = 25C; f = 1 MHz; VIN = 0V.
Table 16:
Parameter
Test Conditions
Value 0.0V to 3.3V 5ns VCC/2 1 TTL GATE and CL = 50pF 1 TTL GATE and CL = 100pF Notes
Input pulse levels--MT29FxGxxxAB Input rise and fall times Input and output timing levels Output load MT29FxGxxxAB (VCC = 3.0V 10%) MT29FxGxxxAB (VCC = 3.3V 10%)
1
Notes: 1. Verified in device characterization; not 100% tested.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
42
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Electrical Characteristics
Table 17: AC Characteristics--Command, Data, and Address Input
x16 Parameter ALE to data start ALE hold time ALE setup time CE# hold time CLE hold time CLE setup time CE# setup time Data hold time Data setup time Write cycle time WE# pulse width www..com HIGH WE# pulse width WP# setup time Symbol
tADL t t
x8 Max -- -- -- -- -- -- -- -- -- -- -- -- -- Min 100 5 10 5 5 10 15 5 10 30 10 15 30 Max -- -- -- -- -- -- -- -- -- -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns Notes 1 2 2 2 2 2 2 2 2 2 2 2
Min 100 10 25 10 10 25 35 10 20 45 15 25 30
ALH ALS tCH t CLH tCLS t CS t DH tDS tWC tWH tWP tWW
Notes: 1. Timing for tADL begins in the ADDRESS cycle, on the final rising edge of WE#, and ends with the first rising edge of WE# for data input. 2. For PROGRAM PAGE CACHE MODE operations, the x16 AC characteristics apply for both x16 and x8 devices.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
43
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Electrical Characteristics
Table 18: AC Characteristics--Normal Operation
x16 Parameter ALE to RE# delay CE# access time CE# HIGH to output High-Z CLE access time CLE to RE# delay Cache busy in page read cache mode (first 31h) Cache busy in page read cache mode (next 31h and 3Fh) Ouput High-Z to RE# LOW Data output hold time www..com Data transfer from Flash array to data register READ cycle time RE# access time RE# HIGH hold time RE# HIGH to output High-Z RE# pulse width Data transfer from Flash array to data register at power-up with PRE enabled @ 3.3V Vcc Ready to RE# LOW Reset time (READ/PROGRAM/ERASE) WE# HIGH to busy WE# HIGH to RE# LOW Symbol
tAR t t
x8 Max -- 45 20 45 -- 3 25 -- -- 25 -- 30 -- 30 -- 25 Min 10 -- -- -- 10 --
tDCBSYR1
Min 10 -- -- -- 10 --
tDCBSYR1
Max 23 20 28 -- 3 25 -- -- 25 -- 18 -- 30 -- 25
Unit ns ns ns ns ns s s ns ns s ns ns ns ns ns s
Notes 1 2 1
CEA CHZ tCLEA t CLR tDCBSYR1
t
DCBSYR2
tIR tOH tR tRC tREA tREH tRHZ tRP tRPRE
0 15 -- 50 -- 15 -- 25 --
0 15 -- 30 -- 10 -- 15 --
1
1 1 1 2 1
tRR tRST tWB tWHR
20 -- -- 60
-- 5/10/500 100 --
20 -- -- 60
-- 5/10/500 100 --
ns s ns ns
3 3, 4
Notes: 1. For PROGRAM PAGE CACHE MODE operations, the x16 AC Characteristics apply for both x16 and x8 devices. 2. Transition is measured 200mV from steady-state voltage with load. This parameter is sampled and not 100% tested. 3. If RESET (FFh) command is loaded at ready state, the device goes busy for maximum 5s. 4. Do not issue a new command during tWB, even if R/B# is ready. 5. The PRE function is not supported on extended-temperature devices.
Table 19:
Parameter
PROGRAM/ERASE Characteristics
Symbol NOP BERS tCBSY tLPROG tPROG
t
Typ -- 2 3 -- 300
Max 8 3 700 -- 700
Unit Cycle ms s -- s
Notes 1 2 3
Number of partial page programs Block erase time Busy time for cache program Last page program time Page program time Notes: 1. 2. 3.
Eight total to the same page. MAX time depends on timing between internal program completion and data in. tLPROG = tPROG (last page) + tPROG (last - 1 page) - cmd load time (last page) - addr load time (last page) - data load time (last page).
tCBSY
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
44
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Timing Diagrams
Figure 33: COMMAND LATCH Cycle
CLE
tCLS tCS tCLH tCH
CE#
tWP
WE#
tALS tALH
www..com
ALE
tDS
tDH
I/Ox
COMMAND
Don`t Care
Note:
x16: I/O[15:8] must be set to "0.
Figure 34:
ADDRESS LATCH Cycle
CLE tCLS tCS tWC CE# tWP WE# tALS ALE tDS I/Ox Address Don`t Care Undefined tDH tALH tWH
Note:
x16: I/O [15:8] must be set to "0."
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
45
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Figure 35:
CLE
tCLH
INPUT DATA LATCH
CE#
tALS tCH
ALE
tWC tWP tWP tWP
WE#
www..com
tDS tWH tDH tDS tDH tDS tDH
I/Ox
DIN 0
DIN 1
DIN Final1
Don`t Care
Notes: 1. DIN Final = 2,111 (x8) or 1,055 (x16).
Figure 36:
SERIAL ACCESS Cycle After READ
tCEA
CE#
tREA tRP tREH tREA
t
REA
tOH
tCHZ
RE#
t
RHZ
tRHZ tOH
I/Ox
DOUT
tRR tRC
DOUT
DOUT
R/B# Don`t Care
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
46
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Figure 37: STATUS READ Cycle
tCLEA tCLR
CLE
tCLS tCLH
tCS
CE#
tWP tCH
WE#
tCEA tCHZ tOH tWHR tRP
www..com
RE#
tRHZ tOH tDS tDH tIR tREA
I/Ox
70h
Status Output
Don`t Care
Figure 38:
CLE
PAGE READ
tCLR
CE#
tWC
WE#
tWB tAR
ALE
tRC tRHZ
RE#
tRR tRP
I/Ox
00h
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
30h
tR
DOUT N
DOUT N+1
DOUT M
Busy R/B#
Don`t Care
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
47
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Figure 39:
CLE
READ Operation with CE# "Don't Care"
CE#
RE#
ALE
tR
R/B#
WE#
www..com
I/Ox
00h
Address (5 Cycles)
30h
Data Output
tCEA
CE#
tREA
RE#
Don`t Care
Out
I/Ox
Figure 40:
RANDOM DATA READ
tCLEA
CLE
tCLR
CE#
WE#
tWB tAR tWHR
ALE
tRC tREA
RE#
tRR
I/Ox
00h
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
30h
tR
DOUT
N
DOUT
N+1
05h
Col Add 1
Col Add 2
E0h
DOUT
M
DOUT
M+1
Busy R/B#
Don't Care
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
48
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
www..com
Figure 41:
PAGE READ CACHE MODE Timing Diagram, Part 1 of 2
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
CLE
tCLS tCLH
tCS
tCH
CE#
tWC
WE#
tCEA
ALE
tRC
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
RE#
tDS tDH
tWB
tR
tRR
Col Add 1 Col Add 2 Row Add 1 Row Add 2 Row Add 3
30h 31h
tREA
DOUT 0 DOUT 1 Page Address M DOUT 31h DOUT 0
I/Ox
00h
Column Address 00h R/B#
Page Address M
tDCBSYR1
tDCBSYR2
Page Address M+1
49
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
Column Address 0
Column Address 0
1
Continued to 1 of next page
Don't Care
www..com
Figure 42:
PAGE READ CACHE MODE Timing Diagram, Part 2 of 2
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
CLE
tCLS tCLH
tCS
tCH
CE#
WE#
tCEA
ALE
tRC
RE#
tWB tRR tDS tDH
tREA
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
I/Ox
DOUT
31h
tDCBSYR2
DOUT 0
DOUT 1
DOUT
31h
tDCBSYR2
DOUT 0
DOUT 1
DOUT
3Fh
tDCBSYR2
DOUT 0
DOUT 1
DOUT
Page Address M+1
Page Address M+2
Page Address M+x
50
R/B#
Column Address 0
Column Address 0
Column Address 0
1
Continued from 1 of previous page
Don't Care
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
www..com
Figure 43:
PAGE READ CACHE MODE Timing without R/B#, Part 1 of 2
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
CLE tCLS tCLH
tCS CE#
tCH
tWC WE# tCEA ALE tRC
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
RE# tDS tDH I/Ox
00h
tREA
Col Add 1 Col Add 2 Row Add 1 Row Add 2 Row Add 3
30h 70h Status 31h 70h Status 00h DOUT 0 DOUT 1 Page Address M DOUT 31h 70h Status 00h DOUT 0 Page Address M+1
Column Address 00h
Page Address M
51
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
I/O 5 = 0, Busy = 1, Ready
I/O 6 = 0, Cache Busy = 1, Cache Ready
I/O 6 = 0, Cache Busy = 1, Cache Ready
Column Address 0
Column Address 0
1
Continued to 1 of next page
Don't Care
www..com
Figure 44:
PAGE READ CACHE MODE Timing without R/B#, Part 2 of 2
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
CLE
tCLS tCLH
tCS
tCH
CE#
WE#
tCEA
ALE
tRC
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
RE#
tDS tDH
tREA
I/Ox
DOUT
31h
70h
Status
00h
DOUT 0
DOUT 1
DOUT
31h
70h
Status
00h
DOUT 0
DOUT 1
DOUT
3Fh
70h
Status
00h
DOUT 0
DOUT 1
DOUT
I/O 6 = 0, Cache Busy = 1, Cache Ready
Page Address M+1
I/O 6 = 0, Cache Busy = 1, Cache Ready
Page Address M+2
I/O 6 = 0, Cache Busy = 1, Cache Ready
Page Address M+x
52
1
Continued from 1 of previous page
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
Column Address 0
Column Address 0
Column Address 0
Don't Care
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Figure 45:
CLE
READ ID Operation
CE#
WE#
tAR
ALE
RE#
www..com
I/Ox 90h 00h Address, 1 Cycle
tWHR
tREA
Byte 0 Manufacturer ID
1
Byte 1 Device ID
1
Byte 2 Don't Care
Byte 31
Figure 46:
Program Operation with CE# "Don't Care"
CLE
CE#
WE#
ALE
I/Ox
80h
Address (5 Cycles)
Data
Input
Data
Input
10h
tCS
tCH
CE#
tWP
WE#
Don`t Care
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
53
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Figure 47:
CLE
PROGRAM PAGE Operation
CE#
tWC tADL
WE#
tWB tPROG
ALE
RE#
www..com
I/Ox 80h SERIAL DATA INPUT Command R/B# x8 device: m = 2,111 byte x16 device: m = 1,055 byte Col Add 1 Col Add 2 Row Add 1 Row Add 2 Row Add 3 DIN N DIN M 10h PROGRAM Command 70h READ STATUS Command Status
1 up to m Byte Serial Input
Don`t Care
Figure 48:
PROGRAM PAGE Operation with RANDOM DATA INPUT
CLE
CE#
tWC tADL tADL
WE#
tWB tPROG
ALE
RE# I/Ox
80h
Col Add 1 Col Add 2 Row Add 1 Row Add 2 Row Add 3 DIN N DIN N+1
85h
Col Add 1
Col Add 2
DIN N
DIN N+1 Serial Input
10h
PROGRAM Command
70h
READ STATUS Command
Status
SERIAL DATA INPUT Command
RANDOM DATA Column Address Serial Input INPUT Command
R/B# Don`t Care
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
54
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Figure 49: INTERNAL DATA MOVE
CLE
CE#
tWC
tADL
WE#
tWB
tWB tPROG
ALE
tR
RE#
I/Ox
00h
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
35h
85h
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
Data 1
Data N
10h
70h
Status
www..com
R/B#
Busy
Busy
READ STATUS Command
INTERNAL DATA MOVE
Don`t Care
Figure 50:
PROGRAM PAGE CACHE MODE
CLE
CE#
tWC
WE#
tADL
tWB tCBSY
ALE
tWB tPROG
RE#
I/Ox
80h SERIAL DATA INPUT
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
DIN N
DIN M
15h PROGRAM
80h
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
DIN N
DIN M
10h
70h
Status
Serial Input
PROGRAM
R/B#
Last Page - 1
Last Page
Don`t Care
Note:
PROGRAM PAGE CACHE MODE operations must not cross die address boundaries.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
55
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
www..com
Figure 51:
PROGRAM PAGE CACHE MODE Ending on 15h
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
CLE
CE#
tWC
WE#
tADL
ALE
RE#
I/Ox
80h SERIAL DATA INPUT
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
DIN N
DIN M
15h
70h
Status
80h
Col Add 1
Col Add 2
Row Add 1
Row Add 2
Row Add 3
DIN N
DIN M
15h PROGRAM
70h
Status
70h
Status
Serial Input
PROGRAM
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Last Page -1
Last Page
Poll status until: I/O6 = 1, Ready To ensure PROGRAM success, last 2 pages: I/O5 = 1, Ready I/O0 = 0, Last page PROGRAM successful I/O1 = 0, Last page -1 PROGRAM successful
56
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
Don`t Care
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Timing Diagrams
Figure 52:
CLE
BLOCK ERASE Operation
CE#
tWC
WE#
tWB tBERS
ALE
RE#
www..com 60h I/Ox
Row Add 1
Row Add 2
Row Add 3
D0h ERASE Command
Busy
70h READ STATUS Command
Status
Row Address
R/B#
AUTO BLOCK ERASE SETUP Command
Don`t Care
Notes: 1. See Table 8 on page 28 for actual values.
Figure 53:
CLE
RESET Operation
CE#
tWB
WE#
tRST
R/B#
I/Ox
FF RESET Command
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
57
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Package Information
Package Information
All dimensions in millimeters; MIN/MAX, or typical, as noted. Figure 54: Package Dimensions
20.00 0.25 18.40 0.08 0.50 TYP PLASTIC PACKAGE MATERIAL: NOVOLAC EPOXY PLATED LEAD FINISH: 90% Sn, 10% Pb OR 100%Sn 0.25 PACKAGE WIDTH AND LENGTH DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE.
PIN #1 INDEX
12.00 0.08
www..com
0.20 0.05
0.25
0.10 +0.03 0.15 -0.02 SEE DETAIL A 1.20 MAX +0.10 -0.05
GAGE PLANE 0.10
0.50 0.1
DETAIL A
0.80
Note:
For design guidelines using the 8Gb device, see Technical Note 2909, at: www.micron.com/products/nand/massstorage/technote
(R)
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992 Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production devices. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
58
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.
2, 4, and 8Gb x8/x16 Multiplexed NAND Flash Memory Revision History Revision History
Rev. H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9/05 * Updated READ STATUS 70h description. Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9/05 * Clarified READ STATUS 70h description on page 29. * Updated Figure 21 on page 29 and moved up under new description. Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/05 * Revised endurance feature on page 1: deleted "with ECC and invalid block mapping." * Updated tR functional description. * Added data retention period. * Clarified AC characteristics. Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7/05 * Replaced DNU definition in Table 1 on page 9. www..com
Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/05 * Updated address latch diagram.
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5/05 * Added WRITE PROTECT. * Updated standby current descriptions.
Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/05 * Updated package drawing.
Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/05 * Initial Release
09005aef818a56a7 pdf/ 09005aef81590bdd source 2gb_nand_m29b__2.fm - Rev. H 9/05 EN
59
Micron Technology, Inc., reserves the right to change products or specifications without notice. (c)2004 Micron Technology, Inc. All rights reserved.

▲Up To Search▲

Price & Availability of MT29F2G08AABWP

	To Download MT29F2G08AABWP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .